[ General Index ]   INTRODUCTION Ordering Information   Quality Assurance System   Recommended Mounting Method   Recommended Solder Pads   Absolute Maximum Ratings   PACKAGE OUTLINE Package Systems Package Line-up Package Characteristics   Package Code Table   Typical Symbols in Package Outline Dimensions   Package Dimensions   Standard Mark Layout   PACKING Packing Specification Table   Packing Illustration   Plastic Tube Dimensions   Taping Dimensions   Tray Dimensions   TCP Dimensions   This Page consists of Introduction (Ordering Information, Quality Assurance System, Recommended Mounting Method), Package Outline and Packing Specification of semiconductor products (Bipolar IC, C-MOS IC, Bi-CMOS IC, GaAs MMIC, OPTOELECTRONIC DEVICES).   For Recommended Mounting Method, Package Outline and Packing Specification of OPTOELECTRONIC DEVICES, please refer to datasheets.

[ General Index ] New Japan Radio Co.,Ltd.