|
|
|
Information on package SOD106; Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors
| Outline drawing of package SOD106 |  |
| Package version | Packagename | Package description | Issue date |
| SOD106 | DO-214AC; SMA; PMOS | Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors | 97-06-09 |
| Chemical content of package SOD106 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
CuSn |
31 mg |
| Plastic/encapsulation |
Epoxy
|
30 mg |
| Active device |
Si
|
2.20 mg |
| Plating |
SnPb20 |
0.60 mg |
|
| Total amount (approx.): |
66.21 mg |
Composition of CuSn
Composition of SnPb20
|
