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Information on package SOD81; Hermetically sealed glass package; ImplotecTM technology; axial leaded; 2 leads; Implotec is a trademark of Philips
| Outline drawing of package SOD81 |  |
| Package version | Packagename | Package description | Issue date |
| SOD81 | - | Hermetically sealed glass package; ImplotecTM technology; axial leaded; 2 leads; Implotec is a trademark of Philips | 97-06-20 |
| Chemical content of package SOD81 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
Fe. Cu cladded70/30
|
240 mg |
| Stud |
Mo
|
10.10 mg |
| Solder/brazing pellet |
AgCu26Ni7 |
0.80 mg |
| Plastic/encapsulation |
Lead borosilicate glass
|
25 mg |
| Active device |
Si
|
0.58 mg |
| Plating |
SnPb20 |
0.26 mg |
|
| Total amount (approx.): |
277.38 mg |
Composition of AgCu26Ni7
Composition of SnPb20
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