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Information on package SOT188-2; plastic leaded chip carrier; 68 leads
| Outline drawing of package SOT188-2 |  |
| Package version | Packagename | Package description | Issue date |
| SOT188-2 | PLCC68 | plastic leaded chip carrier; 68 leads | 95-03-11 |
| Chemical content of package SOT188 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
CuZr0.1
|
0 mg |
| Heatspreader |
Al
|
0 mg |
| Bwire/die attach |
G |
0 mg |
| Plastic/encapsulation |
MP150 SG |
0 mg |
| Active device |
Si
|
20 mg |
|
| Total amount (approx.): |
20 mg |
Composition of MP150 SG
| Br | 1.3
% | | Sb | 1.2
% | | SiO2 | 72
% | | epoxy | 25.5
% |
|
