Go to the CD home page
   
Discretes
Sales Offices & Distributors
 
Catalog tree
-Automotive
-Communications
-Consumer Multimedia
-Discrete semiconductors
-General-purpose / Linear
-Logic
-Microcontrollers
-Programmable logic
Cross reference
Models
Packages
Application notes
Selection guides
Other technical documentation
End of Life information
Information on package SOT23; Plastic surface mounted package; 3 leads

Outline drawing of package SOT23Go to the top of this page
Package versionPackagenamePackage descriptionIssue date
SOT23 TO-236AB; SST3 Plastic surface mounted package; 3 leads 99-09-13 

Chemical content of package SOT23Go to the top of this page
Part Material Weight (mg)
Leadframe FeNi42 3 mg
Bond wire Au 0.10 mg
Plastic/encapsulation Epoxy 5 mg
Active device Si 0.04 mg
Plating SnPb20 0.30 mg
Total amount (approx.): 8 mg
Composition of FeNi42
Co0.5 %
Fe56.5 %
Mn1 %
Ni42 %

Composition of SnPb20
Pb20 %
Sn80 %

Copyright © 2000
Royal Philips Electronics
All rights reserved.
Terms and conditions.


Go to Philips Semiconductors' home page Philips home Feedback your comments and questions Go to semiconductors.com search / index