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Information on package SOT315-1; plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm

Outline drawing of package SOT315-1Go to the top of this page
Package versionPackagenamePackage descriptionIssue date
SOT315-1 LQFP80 plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm 97-07-15 

Chemical content of package SOT315Go to the top of this page
Part Material Weight (mg)
Leadframe CuNi3 178 mg
Bwire/die attach G 2.74 mg
Plastic/encapsulation SUMITOMO EME7320 298 mg
Active device Si 20 mg
Plating SnPb20 18 mg
Total amount (approx.): 516.74 mg
Composition of CuNi3
Cu96.2 %
Ni3 %

Composition of SUMITOMO EME7320
Br0.6 %
Sb2.5 %
SiO280 %
epoxy16.9 %

Composition of SnPb20
Pb20 %
Sn80 %

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