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Information on package SOT337-1; plastic shrink small outline package; 14 leads; body width 5.3 mm
| Outline drawing of package SOT337-1 |  |
| Package version | Packagename | Package description | Issue date |
| SOT337-1 | SSOP14 | plastic shrink small outline package; 14 leads; body width 5.3 mm | 96-01-18 |
| Chemical content of package SOT337 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
CuFe2P |
26 mg |
| Bwire/die attach |
G |
0.36 mg |
| Plastic/encapsulation |
KMC184-8 |
97 mg |
| Active device |
Si
|
0 mg |
| Plating |
SnPb20 |
2 mg |
|
| Total amount (approx.): |
125.36 mg |
Composition of CuFe2P
Composition of KMC184-8
| Br | 1.1
% | | Sb | 3
% | | SiO2 | 80
% | | epoxy | 15.9
% |
Composition of SnPb20
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