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End of Life information
Information on package SOT339-1; plastic shrink small outline package; 20 leads; body width 5.3 mm

Outline drawing of package SOT339-1Go to the top of this page
Package versionPackagenamePackage descriptionIssue date
SOT339-1 SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm 95-02-04 

Chemical content of package SOT339Go to the top of this page
Part Material Weight (mg)
Leadframe CuFe2P 4 mg
Bwire/die attach G 0.78 mg
Plastic/encapsulation KMC184-8 107 mg
Active device Si 0 mg
Plating SnPb20 4 mg
Total amount (approx.): 115.78 mg
Composition of CuFe2P
Cu97.97 %
Fe2 %
Pb0.03 %

Composition of KMC184-8
Br1.1 %
Sb3 %
SiO280 %
epoxy15.9 %

Composition of SnPb20
Pb20 %
Sn80 %

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