Discretes Sales Offices & Distributors   Catalog tree Automotive Communications Consumer Multimedia Discrete semiconductors General-purpose / Linear Logic Microcontrollers Programmable logic Cross reference Models Packages Application notes Selection guides Other technical documentation End of Life information

Information on package SOT346; Plastic surface mounted package; 3 leads Outline drawing Chemical content Outline drawing of package SOT346 Package version Packagename Package description Issue date SOT346  TO-236; SC-59; SMT3; MPAK  Plastic surface mounted package; 3 leads  98-07-17  Chemical content of package SOT346 Part Material Weight (mg) Leadframe FeNi42 3 mg Bond wire Au 0.10 mg Plastic/encapsulation Epoxy 5 mg Active device Si 0.10 mg Plating SnPb20 0.30 mg Total amount (approx.): 8 mg Composition of FeNi42 Co 0.5 % Fe 56.5 % Mn 1 % Ni 42 % Composition of SnPb20 Pb 20 % Sn 80 %

Copyright © 2000 Royal Philips Electronics All rights reserved. Terms and conditions.