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Information on package SOT38-9; plastic dual in-line package; 16 leads (300 mil)
| Outline drawing of package SOT38-9 |  |
| Package version | Packagename | Package description | Issue date |
| SOT38-9 | DIP16 | plastic dual in-line package; 16 leads (300 mil) | 97-07-24 |
| Chemical content of package SOT38 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
Cu
|
276 mg |
| Bond wire |
Au
|
0.30 mg |
| Plastic/encapsulation |
Epoxy
|
650 mg |
| Active device |
Si
|
4.40 mg |
| Plating |
SnPb20 |
16 mg |
|
| Total amount (approx.): |
946.7 mg |
Composition of SnPb20
|
