Go to the CD home page
   
Discretes
Sales Offices & Distributors
 
Catalog tree
-Automotive
-Communications
-Consumer Multimedia
-Discrete semiconductors
-General-purpose / Linear
-Logic
-Microcontrollers
-Programmable logic
Cross reference
Models
Packages
Application notes
Selection guides
Other technical documentation
End of Life information
Information on package SOT389-1; plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm

Outline drawing of package SOT389-1Go to the top of this page
Package versionPackagenamePackage descriptionIssue date
SOT389-1 LQFP44 plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm 97-08-04 

Chemical content of package SOT389Go to the top of this page
Part Material Weight (mg)
Leadframe CuCr 1247 mg
Bwire/die attach G 1.51 mg
Plastic/encapsulation SUMITOMO EME7320 1269 mg
Active device Si 20 mg
Plating SnPb20 65 mg
Total amount (approx.): 2602.51 mg
Composition of CuCr
Cr0.3 %
Cu99.4 %

Composition of SUMITOMO EME7320
Br0.6 %
Sb2.5 %
SiO280 %
epoxy16.9 %

Composition of SnPb20
Pb20 %
Sn80 %

Copyright © 2000
Royal Philips Electronics
All rights reserved.
Terms and conditions.


Go to Philips Semiconductors' home page Philips home Feedback your comments and questions Go to semiconductors.com search / index