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Information on package SOT402-1; plastic thin shrink small outline package; 14 leads; body width 4.4 mm Outline drawing Chemical content Outline drawing of package SOT402-1 Package version Packagename Package description Issue date SOT402-1  TSSOP14  plastic thin shrink small outline package; 14 leads; body width 4.4 mm  95-04-04  Chemical content of package SOT402 Part Material Weight (mg) Leadframe CuNi3 20 mg Bwire/die attach G 0.36 mg Plastic/encapsulation KMC184-8 29 mg Active device Si 0 mg Plating SnPb20 1 mg Total amount (approx.): 50.36 mg Composition of CuNi3 Cu 96.2 % Ni 3 % Composition of KMC184-8 Br 1.1 % Sb 3 % SiO2 80 % epoxy 15.9 % Composition of SnPb20 Pb 20 % Sn 80 %

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