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Information on package SOT429; Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3 lead TO-247
| Outline drawing of package SOT429 |  |
| Package version | Packagename | Package description | Issue date |
| SOT429 | TO-247 | Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3 lead TO-247 | 99-08-04 |
| Chemical content of package SOT429 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
Cu
|
3250 mg |
| Bond wire |
Al
|
20 mg |
| Die attach |
SnAg25Sb10
|
20 mg |
| Plastic/encapsulation |
Epoxy
|
2090 mg |
| Active device |
Si
|
20 mg |
| Plating |
Ni
|
20 mg |
|
| Total amount (approx.): |
5420 mg |
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