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HOME > PRODUCTS > MEMORY > MCP (MULTI CHIP PACKAGE) > OVERVIEW MCP (Multi Chip Package) Product Features The ultra-small-sized MCP seals large capacity flash memory, low-power SRAM and mobileRAM in one package and substantially reduces the mounted area TSOP-type S-µMCP and BGA-type S-CSP are commercially produced together with stacking assembly technology Main Applications All types of general mobile equipment like cellular phones, PDA, etc