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Sumitomo/Eudyna/FUJITSU
- WLCSP MMICs for Micro/Millimeter-wave Applications
SEI/SEDI proposes the
WLCSP (Wafer
Level
Chip
Scale
Package)
technology for the
solution of the next
generation device.
This technology achieved a very excellent frequency performance by uniting with 3- D MMIC technology, and can apply from C to E-band applications.
The WLCSP chip is the flip chip form with the solder ball and it is mountable in the SMT production line.
It is unnecessary the wire bonding, it can achieve high mass productivity up to high frequency range.
Features
- Low Cost Surface Mount Type Device
- Flip
Chip Form
with Solder
Ball
Solder Ball Diameter: 165um
Solder Ball Pitch: 400um - Applicable from C to E-Band application.
- Small Size
- Highly Integrated
- Chip Level Protection against Humidity
- RoHS Compliance
- Outline of WLCSP MMIC
- SMM5139XZ
♦ Process
Product Lineup
13/15GHz | 18/23GHz | 24/30GHz | |
---|---|---|---|
Low Noise Amp | SMM5722XZ | SMM5723XZ* | SMM5724XZ* |
Up Converter |
SMM5138XZ SMM5145XZ |
SMM5141XZ* | SMM5143XZ* |
Down Converter |
SMM5139XZ SMM5146XZ |
SMM5142XZ | SMM5144XZ* |
- * Under Development
- Selection Guide
Power Amplifier MMIC Lineup (Package)
Power Amplifier MMIC Lineup (Chip)
Low Noise Amplifier MMIC Lineup