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models are available for the following AT series devices:
SPICE model
** DIE MODEL (excludes bond wires)
.SUBCKT AT305 75 20 85
CBBP 20 75 .03PF
CEBP 85 75 .03PF
QINT 75 20 85 Q305
.ENDS
.MODEL Q305 NPN (BF=100, BR=2.5, IS=7.8E-17, VA=20, TF=12PS,
+ CJE=1.1E-13, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+ VTF=6, ITF=1.4E-2, IKF=6.3E-3, XTF=4, NF=1.03, ISE=2.4E-13,
+ NE=2.5, RB=38.49, RE=2.44, RC=61.57, CJC=5.1E-14, CJS=7E-14,
+ XCJC=0.19, PS=0.8, MS=0.5, PC=0.76, MC=0.53)
To complete the transistor model, the above die model must be combined with one of the following package models.
SPICE model
* DIE MODEL (excludes bond wires)
.SUBCKT AT310 75 20 85
CBBP 20 75 .03PF
CEBP 85 75 .03PF
QINT 75 20 85 Q310
.ENDS
.MODEL Q310 NPN (BF=100, BR=2.5, IS=1.6E-16, VA=20, TF=12PS,
+ CJE=2.3E-13, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+ VTF=6, ITF=2.9E-2, IKF=1.3E-2, XTF=4, NF=1.03, ISE=4.8E-13,
+ NE=2.5, RB=19.44, RE=1.22, RC=40.68, CJC=9.5E-14, CJS=1E-13,
+ XCJC=0.20, PS=0.8, MS=0.5, PC=0.76, MC=0.53)
To complete the transistor model, the above die model must be combined with one of the following package models.
SPICE model
* DIE MODEL (excludes bond wires)
.SUBCKT AT320 75 20 85
CBBP 20 75 .03PF; BASE BOND PAD CAPACITANCE
CEBP 85 75 .03PF; EMITTER BOND PAD CAPACITANCE
QINT 75 20 85 Q320
.ENDS
.MODEL Q320 NPN (BF=100, BR=2.5, IS=3.1E-16, VA=20, TF=12PS,
+ CJE=4.6E-13, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+ VTF=6, ITF=5.7E-2, IKF=2.5E-2, XTF=4, NF=1.03, ISE=9.5E-13,
+ NE=2.5, RB=9.78, RE=0.61, RC=35.97, CJC=1.8E-13, CJS=1.7E-13,
+ XCJC=0.20, PS=0.8, MS=0.5, PC=0.76, MC=0.53)
To complete the transistor model, the above die model must be combined with one of the following package models.
SPICE model
* DIE MODEL (excludes bond wires)
.SUBCKT AT414 75 20 85
CCB 20 60 .032PF
DCD1 20 60 DMOD 572
RRB1 20 25 1.07 TC=0.8E-3
DCD2 25 60 DMOD 680
RRB2 25 30 3.2 TC=1.2E-3
DCD3 30 60 DMOD 340
RRB3 30 35 2.7 TC=1.8E-3
RRC 60 75 5 TC=0.6E-3
RRE 80 85 .24 TC=0.6E-3
CCE 60 85 .032PF
QINT 60 35 80 QDIS 420
.ENDS
.MODEL DMOD D(IS=1E-25, CJO=2.45E-16, VJ=.76, M=.53, BV=45, IBV=1E-9)
.MODEL QDIS NPN (BF=100, BR=2.5, IS=1.65E-18, VA=20, TF=12PS,
+ CJE=2.4E-15, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+ VTF=6, ITF=3E-4, IKF=1.3E-4, XTF=4, NF=1.03, ISE=5E-15,
+ NE=2.5)
To complete the transistor model, the above die model must be combined with one of the following package models.
SPICE model
* DIE MODEL (excludes bond wires)
.SUBCKT AT415 75 20 85
CBBP 20 75 .064PF; BASE BOND PAD CAPACITANCE
CEBP 85 75 .064PF; EMITTER BOND PAD CAPACITANCE
QINT 75 20 85 Q415
.ENDS
.MODEL Q415 NPN (BF=100, BR=2.5, IS=4.2E-16, VA=20, TF=12PS,
+ CJE=6E-13, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+ VTF=6, ITF=7.6E-2, IKF=3.4E-2, XTF=4, NF=1.03, ISE=1.3E-12,
+ NE=2.5, RB=11.57, RE=0.4, RC=18.03, CJC=2.5E-13, CJS=2.3E-13,
+ XCJC=0.20, PS=0.8, MS=0.5, PC=0.76, MC=0.53)
To complete the transistor model, the above die model must be combined with one of the following package models.
SPICE model
** DIE MODEL (excludes bond wires)
.SUBCKT AT420 75 20 85
CCB 20 60 .034PF
DCD1 20 60 DMOD 783
RRB1 20 25 0.7 TC=0.8E-3
DCD2 25 60 DMOD 972
RRB2 25 30 2.2 TC=1.2E-3
DCD3 30 60 DMOD 486
RRB3 30 35 1.9 TC=1.8E-3
RRC 60 75 5 TC=0.6E-3
RRE 80 85 .17 TC=0.6E-3
CCE 60 85 .034PF
QINT 60 35 80 QDIS 600
.ENDS
.MODEL DMOD D(IS=1E-25, CJO=2.45E-16, VJ=.76, M=.53, BV=45, IBV=1E-9)
.MODEL QDIS NPN (BF=90, BR=2.5, IS=1.7E-18, VA=20, TF=12PS,
+ CJE=2.4E-15, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+ VTF=6, ITF=3E-4, IKF=1.3E-4, XTF=4, NF=1.03, ISE=5E-15,
+ NE=2.5)
To complete the transistor model, the above die model must be combined with one of the following package models.
SPICE model
** DIE MODEL (excludes bond wires)
.SUBCKT AT640 75 20 85
QINT 75 20 85 Q640
.ENDS
.MODEL Q640 NPN (BF=100, BR=2.5, IS=2E-15, VA=20, TF=12PS,
+ CJE=2.9E-12, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818,
+ VTF=6, ITF=3.6E-1, IKF=1.6E-1, XTF=4, NF=1.03, ISE=6E-12,
+ NE=2.5, RB=2.83, RE=0.8, RC=33.95, CJC=1.6E-12, CJS=1.1E-12,
+ XCJC=0.15, PS=0.8, MS=0.5, PC=0.76, MC=0.53)
To complete the transistor model, the above die model must be combined with one of the following package models.
SPICE model
* PSPICE MODEL for HBFP-0405 in SOT343
.SUBCKT HBFP0405 60 20 40
LL1 20 25 .22NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 25 0 .08PF
LT1 25 30 .20NH
C2T1 30 0 .05PF
*
LLB 30 35 .70NH
CCEB 30 50 .04PF
LL2 40 45 .15NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 45 0 .04PF
LT2 45 50 .10NH
C2T2 50 0 .10PF
*
LLE 50 55 .20NH
CCEC 50 70 .01PF
LL3 60 65 .20NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 65 0 .144PF
LT3 65 70 .50NH
C2T3 70 0 .10PF
*
LLC 70 75 .70PF
CCBC 30 70 .05PF
* CALL DIE MODEL
XDIE 75 35 55 H0405
.ENDS
.SUBCKT H0405 75 20 85
RBX 20 130 3.74196
RCX 140 75 6.5915
RE 150 85 1.565
RSE 160 85 1
CCOX 20 140 17.213E-15
CEOX 130 85 6.227E-15
DBC 20 140 DMOD1
DBE 130 150 DMOD2
DCS 160 140 DMOD3
QINT 140 130 150 160 Q405
.ENDS
.MODEL DMOD1 D(IS=1.40507E-17,CJO=2.393E-14,VJ=.729,M=.44,TNOM=21,N=1,FC=0.8)
.MODEL DMOD2 D(IS=1E-24,CJO=2.593E-14,VJ=.8971,M=.2292,TNOM=21,N=1.0029,FC=0.8)
.MODEL DMOD3 D(IS=1E-24,CJO=8.974E-14,VJ=0.6,M=0.42 ,RS=2.17347E2,FC=0.8TNOM=21)
.MODEL Q405 NPN (BF=1E6, IS=4.4746E-18, VA=44,
+ BR=1, ME=0.5063, NF=1, PTF=22,
+ TF=5.3706E-12, CJE= 7.474248E-14, XTF=20, IK=1.4737E-01,
+ PE=0.9907, ISE=7.094E-20, NE=1.006, VTF=0.8,
+ XTB=0.7, ITF=2.21805486E-1, RB=9.30144818,
+ CJC=2.7056E-14, XCJC=0.439790997,
+ PC=0.6775, MC=0.3319, FC=0.8, IKR=1.1E-2, NC=2, VAR=3.37,
+ NR=1.005, TR=4E-9, TNOM=21, IRB=3.029562E-6, RBM=0.1, XTI=3
+ EG=1.17)
* Note: high beta value compensates for current leakage through DBE
SPICE model
* PSPICE MODEL for HBFP-0420 in SOT343
.SUBCKT HBFP0420 60 20 40
LL1 20 25 .22NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 25 0 .08PF
LT1 25 30 .20NH
C2T1 30 0 .05PF
*
LLB 30 35 .70NH
CCEB 30 50 .04PF
LL2 40 45 .15NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 45 0 .04PF
LT2 45 50 .10NH
C2T2 50 0 .10PF
*
LLE 50 55 .20NH
CCEC 50 70 .01PF
LL3 60 65 .20NH
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 65 0 .144PF
LT3 65 70 .50NH
C2T3 70 0 .10PF
*
LLC 70 75 .70PF
CCBC 30 70 .05PF
* CALL DIE MODEL
XDIE 75 35 55 H0420
.ENDS
.SUBCKT H0420 75 20 85
RBX 20 130 3.74196
RCX 140 75 6.5915
RE 150 85 1.565
RSE 160 85 1
CCOX 20 140 17.213E-15
CEOX 130 85 6.227E-15
DBC 20 140 DMOD1 3
DBE 130 150 DMOD2 3
DCS 160 140 DMOD3 3
QINT 140 130 150 160 Q405 3
.ENDS
.MODEL DMOD1 D(IS=1.40507E-17, CJO=2.393E-14,
+ VJ=.729, M=.44, TNOM=21, N=1, FC=0.8)
.MODEL DMOD2 D(IS=1E-24, CJO=2.593E-14, VJ=.8971,
+ M=.2292, TNOM=21, N=1.0029, FC=0.8)
.MODEL DMOD3 D(IS=1E-24, CJO=8.974E-14, VJ=0.6,
+ M=0.42, RS=2.17347E2, FC=0.8, TNOM=21)
.MODEL Q405 NPN (BF=1E6, IS=4.4746E-18, VA=44,
+ BR=1,ME=0.5063, NF=1, PTF=22, TF=5.3706E-12,
+ CJE= 7.474248E-14, XTF=20, IK=1.4737E-01,
+ PE=0.9907, ISE=7.094E-20, NE=1.006, VTF=0.8,
+ XTB=0.7, ITF=2.21805486E-1, RB=9.30144818,
+ CJC=2.7056E-14, XCJC=0.439790997,
+ PC=0.6775, MC=0.3319, FC=0.8, IKR=1.1E-2, NC=2, VAR=3.37,
+ NR=1.005, TR=4E-9, TNOM=21, IRB=3.029562E-6, RBM=0.1, XTI=3
+ EG=1.17)
* Note: high beta value compensates for current leakage through DBE
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Design
SPICE
