| part number |
NF, dB
@ 0.1 GHz |
Gp, dB
@ 0.1 GHz |
package |
outline |
data sheet |
|
 |
| INA-01170 |
2.0 typ
2.5 max |
32.5 typ
30 min |
70 mil
ceramic |
 |
pdf |
|
|
INA-01100
(obsolete) |
2.0 typ |
32.5 typ |
chip |
 |
pdf |
|
bias: 5.5 V, 35 mA
f3dB = 500 MHz
G = 32.5 dB, NF = 1.7 dB, P1dB = 11 dBm, IP3i = -11.5dBm
packages: 70
SPICE model
* INA-01 DIE MODEL
* Combine with package model to complete
* DIE MODEL
XNA01 DIEOUT DIEIN DIEGND INA01
.ENDS
* chip model
.SUBCKT INA01 DIEOUT DIEIN DIEGND
RBIAS1 Q2E 14 155 (TC1=-0.8E-3)
RBIAS2 Q3E 14 67 (TC1=-0.8E-3)
RE2 Q3E DIEGND 25 (TC1=-0.8E-3)
RF1 DIEIN 14 1500 (TC1=-0.8E-3)
RF2 Q1C DIEOUT 380 (TC1=-0.8E-3)
LP1 11 DIEGND 0.20NH
LP2 15 DIEGND 0.20NH
CP1 11 DIEGND 0.35PF
CP2 15 DIEGND 0.50PF
C3 DIEOUT DIEGND 0.25PF
C4 Q1C DIEGND 0.036PF
C5 DIEIN DIEGND 0.086PF
C13 Q2E DIEGND 0.023PF
C14 14 DIEGND 0.036PF
C16 Q3E DIEGND 0.029PF
XNA01Q1 Q1C DIEIN Q1E DIEGND a01Q1
XNA01Q2 DIEOUT Q1C Q2E DIEGND a01Q2
XNA01Q3 DIEOUT Q2E Q3E DIEGND a01Q3
.ENDS
* Q1 distributed base model
.SUBCKT a01Q1 Q1C Q1B Q1E Q1S
RC1 6 5 10 (TC1=0.6E-3)
RC2 5 Q1C 10 (TC1=0.6E-3)
RB1 Q1B 7 1.1 (TC1=0.8E-3)
RB2 7 8 3.2 (TC1=1.2E-3)
RB3 8 B1 2.7 (TC1=1.8E-3)
RE E1 Q1E 0.24 (TC1=0.6E-3)
Q1 C1 B1 E1 QINA 420
DCD1 Q1B C1 DMOD 572
DCD2 7 C1 DMOD 680
DCD3 8 C1 DMOD 340
DCS 5 Q1S DMOD 2475
.ENDS
* Q2 distributed base model
.SUBCKT a01Q2 Q2C Q2B Q2E Q2S
RC1 6 5 10 (TC1=0.6E-3)
RC2 5 Q2C 10 (TC1=0.6E-3)
RB1 Q2B 7 1.1 (TC1=0.8E-3)
RB2 7 8 3.2 (TC1=1.2E-3)
RB3 8 B1 2.7 (TC1=1.8E-3)
RE E1 Q2E 0.28 (TC1=0.6E-3)
Q1 C1 B1 E1 QINA 420
DCD1 Q2B C1 DMOD 570
DCD2 7 C1 DMOD 680
DCD3 8 C1 DMOD 340
DCS 5 Q2S DMOD 2475
.ENDS
* Q3 distributed base model
.SUBCKT a01Q3 Q3C Q3B Q3E Q3S
RC1 6 5 9 (TC1=0.6E-3)
RC2 5 Q3C 8 (TC1=0.6E-3)
RB1 Q3B 7 1.2 (TC1=0.8E-3)
RB2 7 8 3.7 (TC1=1.2E-3)
RB3 8 B1 3.1 (TC1=1.8E-3)
RE E1 Q3E 0.28 (TC1=0.6E-3)
Q1 C1 B1 E1 QINA 360
DCD1 Q3B C1 DMOD 502
DCD2 7 C1 DMOD 583
DCD3 8 C1 DMOD 292
DCS 5 Q3S DMOD2 2409
.ENDS
.MODEL DMOD D(IS=1E-25, CJO=2.4E-16, VJ=.76,
+ M=.53, BV=45)
.MODEL DMOD2 D(IS=1E-25, CJO=1.2E-16, VJ=.80,
+ M=.50, BV=45, RS=1.0E+06)
.MODEL QINA NPN (BF=100, BR=2.5, IS=1.7E-18,
+ VA=20, TF=12PS, CJE=2.4E-15, VJE=1.01,
+ MJE=0.6, PTF=25, XTB=1.818, VTF=6,
+ ITF=3E-4,IKF=1.3E-4, XTF=4, NF=1.03,
+ ISE=5E-15, NE=2.5)
To complete the IC model, the above die model must be combined
with one of the following package models.
| |
| file name | description | |
| a01170ia.s2p | INA-01170 s and noise parameters at 35 mA | 
view |
Applications Literature
General Information about Amplifier ICs
Information about INA Series IC Amplifiers
Assembly Information
|
