| part number |
NF, dB
@ 0.5 GHz |
Gp, dB
@ 0.5 GHz |
package |
outline |
data sheet |
|
 |
| INA-02170 |
2.0 typ
2.5 max |
31.5 typ
29 min |
70 mil
ceramic |
 |
pdf |
|
|
| INA-02184 |
2.0 typ
2.5 max |
31.5 typ
29 min |
85 mil
plastic
trim lead |
 |
pdf |
|
|
| INA-02186 |
2.0 typ
2.5 max |
31.5 typ
29 min |
SMT
85 mil
plastic |
 |
pdf |
|
|
INA-02100
(obsolete) |
2.0 typ |
31.5 typ |
chip |
 |
pdf |
|
bias: 5.5 V, 35 mA
f3dB = 1 GHz
G = 31.5 dB, NF = 2.0 dB, P1dB = 11 dBm, IP3i = -9.5 dBm
packages: 70, 84, 86
SPICE model
* INA-02 DIE MODEL
* Combine with package model to complete
* DIE MODEL
XNA02 DIEOUT DIEIN DIEGND INA02
.ENDS
* chip model
.SUBCKT INA02 DIEOUT DIEIN DIEGND
RBIAS1 Q2E 14 155 (TC1=-0.8E-3)
RBIAS2 Q3E 14 67 (TC1=-0.8E-3)
RE2 Q3E DIEGND 25 (TC1=-0.8E-3)
RF1 DIEIN 14 1250 (TC1=-0.8E-3)
RF2 Q1C DIEOUT 475 (TC1=-0.8E-3)
LP1 11 DIEGND 0.20NH
LP2 15 DIEGND 0.20NH
CP1 11 DIEGND 0.35PF
CP2 15 DIEGND 0.50PF
C3 DIEOUT DIEGND 0.25PF
C4 Q1C DIEGND 0.036PF
C5 DIEIN DIEGND 0.086PF
C13 Q2E DIEGND 0.023PF
C14 14 DIEGND 0.036PF
C16 Q3E DIEGND 0.029PF
XNA02Q1 Q1C DIEIN Q1E DIEGND a02Q1
XNA02Q2 DIEOUT Q1C Q2E DIEGND a02Q2
XNA02Q3 DIEOUT Q2E Q3E DIEGND a02Q3
.ENDS
* Q1 distributed base model
.SUBCKT a02Q1 Q1C Q1B Q1E Q1S
RC1 6 5 8 (TC1=0.6E-3)
RC2 5 Q1C 17 (TC1=0.6E-3)
RB1 Q1B 7 1.8 (TC1=0.8E-3)
RB2 7 8 5.6 (TC1=1.2E-3)
RB3 8 B1 4.7 (TC1=1.8E-3)
RE E1 Q1E 0.42 (TC1=0.6E-3)
Q1 C1 B1 E1 QINA 240
DCD1 Q1B C1 DMOD 362
DCD2 7 C1 DMOD 389
DCD3 8 C1 DMOD 195
DCS 5 Q1S DMOD 1683
.ENDS
* Q2 distributed base model
.SUBCKT a02Q2 Q2C Q2B Q2E Q2S
RC1 6 5 10 (TC1=0.6E-3)
RC2 5 Q2C 10 (TC1=0.6E-3)
RB1 Q2B 7 1.1 (TC1=0.8E-3)
RB2 7 8 3.2 (TC1=1.2E-3)
RB3 8 B1 2.7 (TC1=1.8E-3)
RE E1 Q2E 0.24 (TC1=0.6E-3)
Q1 C1 B1 E1 QINA 420
DCD1 Q2B C1 DMOD 572
DCD2 7 C1 DMOD 680
DCD3 8 C1 DMOD 340
DCS 5 Q2S DMOD 2475
.ENDS
* Q3 distributed base model
.SUBCKT a02Q3 Q3C Q3B Q3E Q3S
RC1 6 5 9 (TC1=0.6E-3)
RC2 5 Q3C 7 (TC1=0.6E-3)
RB1 Q3B 7 1.2 (TC1=0.8E-3)
RB2 7 8 3.7 (TC1=1.2E-3)
RB3 8 B1 3.1 (TC1=1.8E-3)
RE E1 Q3E 0.28 (TC1=0.6E-3)
Q1 C1 B1 E1 QINA 360
DCD1 Q3B C1 DMOD 502
DCD2 7 C1 DMOD 583
DCD3 8 C1 DMOD 292
DCS 5 Q3S DMOD2 2409
.ENDS
.MODEL DMOD D(IS=1E-25, CJO=2.4E-16, VJ=.76,
+ M=.53, BV=45)
.MODEL DMOD2 D(IS=1E-25, CJO=1.2E-16, VJ=.80,
+ M=.50, BV=45, RS=1.0E+06)
.MODEL QINA NPN (BF=100, BR=2.5, IS=1.7E-18,
+ VA=20, TF=12PS, CJE=2.4E-15, VJE=1.01,
+ MJE=0.6, PTF=25, XTB=1.818, VTF=6,
+ ITF=3E-4, IKF=1.3E-4, XTF=4, NF=1.03,
+ ISE=5E-15, NE=2.5)
To complete the IC model, the above die model must be combined
with one of the following package models.
| |
| file name | description | |
| a02100ia.s2p | INA-02100 s parameters at 35 mA | 
view |
| a02170ia.s2p | INA-02170 s and noise parameters at 35 mA |
view |
| a02184ia.s2p | INA-02184 s parameters at 35 mA |
view |
| a02186ia.s2p | INA-02186 s parameters at 35 mA |
view |
Applications Literature
General Information about Amplifier ICs
Information about INA Series IC Amplifiers
Assembly Information
|
