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models are available for the following INA series packages:
- 00 (chip)
- 70 (70 mil ceramic)
- 84 (trim lead 84 mil plastic)
- 86 (SMT 85 mil plastic)
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- SPICE model for INA Gain Blocks in style 00 package (chip form)
*replace "INA***00" in line 1 with product name
*e.g. : .SUBCKT INa01100 OUT IN GND
*replace "INA**" in line 6 with die callout
*e.g. : XDIE 3 1 2 INa01
.SUBCKT INA***00 OUT IN GND
LIN IN 1 .35NH
LOUT OUT 3 .35NH
LGND GND 2 .1NH
* CALL DIE MODEL
XDIE 3 1 2 INA**
.ENDS
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- SPICE model for INA Gain Blocks in style 70 package7
*replace "INA**70 in line 2 with product name
*e.g. : .SUBCKT INa01170 OUT IN GND
*replace "XNA**" in line 27 with die callout
*e.g. : XNa01 DIEOUT DIEIN DIEGND INa01
* "70" PACKAGE MODEL
.SUBCKT INA**70 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .070PF
LT1 11 12 .224NH
C2T1 12 0 .070PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .019PF
LT2 14 15 .034NH
C2T2 15 0 .019PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .098PF
LT3 13 16 .312NH
C2T3 16 0 .098PF
* Bond wire inductance
LIN 12 DIEIN .35NH
LOUT 16 DIEGND .35NH
LGND 15 DIEOUT .10NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .02PF
CCEC 15 DIEOUT .01PF
CCBC 12 DIEOUT .02PF
* INSERT DIE MODEL
XNA**DIE DIEOUT DIEIN DIEGND INA**
.ENDS
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- SPICE model for INA Gain Blocks in style 84 package
*replace "INA***84" in line 2 with product name
*e.g. : .SUBCKT INa02184 OUT IN GND
*replace "A**" in line 27 with die callout
*e.g. : XNa02DIE DIEOUT DIEIN DIEGND INa02
* "84" PACKAGE MODEL
.SUBCKT INA***84 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .059PF
LT1 11 12 .493NH
C2T1 12 0 .059PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .042PF
LT2 14 15 .076NH
C2T2 15 0 .042PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .039PF
LT3 13 16 .330NH
C2T3 16 0 .039PF
* Bond wire inductance
LIN 12 DIEIN .35NH
LOUT 16 DIEOUT .35NH
LGND 15 DIEGND .1NH
* Contact inductance
LL1 IN 11 .05NH
LL2 GND 14 .01NH
LL3 OUT 13 .05NH
*Parasitic capacitances
CCEB 12 15 .02PF
CCEC 15 DIEOUT .03PF
CCBC 12 DIEOUT .03PF
* INSERT DIE MODEL
XNA**DIE DIEOUT DIEIN DIEGND INA**
.ENDS
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- SPICE model for INA Gain Blocks in style 86 package
*replace "INA***86" in line 2 with product name
*e.g. : .SUBCKT INa02186 OUT IN GND
*replace "XNA**" in line 27 with die callout
*e.g. : XNa02DIE DIEOUT DIEIN DIEGND INa02
* "86" PACKAGE MODEL
.SUBCKT INA**86 OUT IN GND
* PI NETWORK TO SIMULATE TRANSMISSION LINE T1
C1T1 11 0 .059PF
LT1 11 12 .493NH
C2T1 12 0 .059PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T2
C1T2 14 0 .042PF
LT2 14 15 .076NH
C2T2 15 0 .042PF
* PI NETWORK TO SIMULATE TRANSMISSION LINE T3
C1T3 13 0 .039PF
LT3 13 16 .330NH
C2T3 16 0 .039PF
* Bond wire inductance
LIN 12 DIEIN .35NH
LOUT 16 DIEOUT .35NH
LGND 15 DIEGND .1NH
* Contact inductance
LL1 IN 11 .55NH
LL2 GND 14 .06NH
LL3 OUT 13 .25NH
*Parasitic capacitances
CCEB 12 15 .02PF
CCEC 15 DIEOUT .03PF
CCBC 12 DIEOUT .03PF
* INSERT DIE MODEL
XNA**DIE DIEOUT DIEIN DIEGND INA**
.ENDS
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