bias: 7 V, 50 mA
f3dB = 3.8 GHz
G = 8 dB, NF = 7 dB, P1dB = 11.5 dBm, IP3i = +13.5 dBm
| part number |
Gp, dB
@ 0.1 GHz |
P1dB, dBm
@ 1 GHz |
package |
outline |
data sheet |
|
 |
| MSA-0404 |
8.0 typ
7.0 min
@ 0.5 GHz |
11.5 typ
@ 50 mA |
145 mil
plastic |
 |
pdf |
|
|
| MSA-0420 |
8.5 typ
7.5 min |
16.0 typ
14.0 min
@ 90 mA |
200 mil
BeO disc |
 |
pdf |
|
|
| MSA-0435 |
8.5 typ
7.5 min |
12.5 typ
@ 50 mA |
micro-x |
 |
pdf |
|
|
| MSA-0436 |
8.5 typ
7.5 min |
12.5 typ
@ 50 mA |
micro-x
trim lead |
 |
pdf |
|
|
| MSA-0470 |
8.5 typ
7.5 min |
12.5 typ
@ 50 mA |
70 mil
ceramic |
 |
pdf |
|
|
| MSA-0485 |
8.0 typ
7.0 min
@ 1 GHz |
12.5 typ
@ 50 mA |
85 mil
plastic |
 |
pdf |
|
|
| MSA-0486 |
8.0 typ
7.0 min
@ 1 GHz |
12.5 typ
@ 50 mA |
SMT
85 mil
plastic |
 |
pdf |
|
|
MSA-0400
(obsolete) |
8.5 typ |
16.0 typ
@ 90 mA |
chip |
 |
pdf |
|
packages: 00 04 20 35 36 70 85 86
SPICE model
* MSA-04 MODEL
* Combine with package model to complete
* DIE MODEL
Xa04 DIEOUT DIEIN DIEGND MSa04
.ENDS
* chip model
.SUBCKT MSa04 DIEOUT DIEIN DIEGND
RF DIEIN DIEOUT 230 (TC1=-0.8E-3)
RB DIEIN DIEGND 122 (TC1=-0.8E-3)
RBIAS Q1E DIEGND 134 (TC1=-0.8E-3)
RE Q2E DIEGND 11 (TC1=-0.8E-3)
CF DIEIN DIEOUT 0.12PF
CP1 Q1E DIEOUT 0.033PF
CP3 DIEGND DIEOUT 0.103PF
Xa04Q1 DIEOUT DIEIN Q1E a04Q1
Xa04Q2 DIEOUT Q1E Q2E a04Q2
.ENDS
* Q1 distributed base model
.SUBCKT a04Q1 Q1C Q1B Q1E
RB1 Q1B 11 1.7 (TC1=0.8E-3)
RB2 11 12 4.4 (TC1=1.2E-3)
RB3 12 B1 3.3 (TC1=1.8E-3)
RE E1 Q1E 0.26 (TC1=0.6E-3)
RC C1 Q1C 5 (TC1=0.6E-3)
Q1 C1 B1 E1 QMSA 375
DCD1 Q1B C1 DMOD 780
DCD2 11 C1 DMOD 1131
DCD3 12 C1 DMOD 331
.ENDS
* Q2 distributed base model
.SUBCKT a04Q2 Q2C Q2B Q2E
RB1 Q2B 21 1.0 (TC1=0.8E-3)
RB2 21 22 2.6 (TC1=1.2E-3)
RB3 22 B2 2.0 (TC1=1.8E-3)
RE E2 Q2E 0.16 (TC1=0.6E-3)
RC C2 Q2C 5 (TC1=0.6E-3)
Q1 C2 B2 E2 QMSA 625
DCD1 Q2B C2 DMOD 1204
DCD2 21 C2 DMOD 1885
DCD3 22 C2 DMOD 551
.ENDS
.MODEL DMOD D(IS=1E-25, CJO=2.45E-16, VJ=.76,
+ M=.53, BV=45, IBV=1E-9)
.MODEL QMSA NPN (BF=90, BR=5, IS=1.65E-18, VA=20,
+ TF=12PS, CJE=1.8E-15, VJE=1.01, MJE=0.6,
+ PTF=25, XTB=1.818, VTF=6, ITF=3E-4,
+ IKF=1.333E-4, XTF=4, NF=1.03, ISE=5E-15,
+ NE=2.5)
To complete the transistor model, the above die model must be combined
with one of the following package models.
| file name | description | |
| a0400i50.s2p | MSA-0400 s and noise parameters at 50 mA | 
view |
| a0400i90.s2p | MSA-0400 s parameters at 90 mA |
view |
| a0404i50.s2p | MSA-0404 s and noise parameters at 50 mA |
view |
| a0420i90.s2p | MSA-0420 s and noise parameters at 50 mA |
view |
| a0435i50.s2p | MSA-0435 s and noise parameters at 50 mA |
view |
| a0435i50.s2p | MSA-0436 s and noise parameters at 50 mA |
view |
| a0470i50.s2p | MSA-0470 s and noise parameters at 50 mA |
view |
| a0485i50.s2p | MSA-0485 s and noise parameters at 50 mA |
view |
| a0486i50.s2p | MSA-0486 s and noise parameters at 50 mA |
view |
Applications Literature
General Information about Amplifier ICs
Information about MSA Series IC Amplifiers
Assembly Information
|
