bias: 5V, 16 mA
f3dB = 1.0 GHz
G = 19 dB, NF = 3 dB, P1dB = 2 dBm, IP3i = -7 dBm
| part number |
NF, dB
@ 500 MHz |
Gp, dB
@ 500 MHz |
package |
outline |
data sheet |
|
 |
| MSA-0611 |
3.0 typ |
18.0 typ
16.0 min |
SOT-143 |
 |
pdf |
|
|
| MSA-0635 |
2.8 typ
4.0 max |
20.5 typ
19.0 min
at 0.1 GHz |
micro-x |
 |
pdf |
|
|
| MSA-0636 |
2.8 typ
4.0 max |
20.5 typ
19.0 min
at 0.1 GHz |
micro-x
trim lead |
 |
pdf |
|
|
| MSA-0670 |
2.8 typ
4.0 max |
20.5 typ
19.0 min
at 0.1 GHz |
70 mil
ceramic |
 |
pdf |
|
|
| MSA-0685 |
3.0 typ |
18.5 typ
17.0 min |
85 mil
plastic |
 |
pdf |
|
|
| MSA-0686 |
3.0 typ |
18.5 typ
17.0 min |
SMT
85 mil
plastic |
 |
pdf |
|
|
MSA-0600
(obsolete) |
2.8 typ |
20.5 typ
@ 0.1 GHz |
chip |
 |
pdf |
|
packages: 00 11 35 36 70 85 86
SPICE model
* MSA-06 MODEL
* Combine with package model to complete
* DIE MODEL
Xa06 DIEOUT DIEIN DIEGND MSa06
.ENDS
* chip model
.SUBCKT MSa06 DIEOUT DIEIN DIEGND
RF DIEIN DIEOUT 600 (TC1=-0.8E-3)
RB DIEIN DIEGND 480 (TC1=-0.8E-3)
RBIAS Q1E DIEGND 157 (TC1=-0.8E-3)
RE Q2E DIEGND 0
CF DIEIN DIEOUT 0.083PF
CP1 Q1E DIEOUT 0.019PF
CP2 Q2E DIEOUT 0.010PF
CP3 DIEGND DIEOUT 0.085PF
Xa06Q1 DIEOUT DIEIN Q1E a06Q1
Xa06Q2 DIEOUT Q1E Q2E a06Q2
.ENDS
* Q1 distributed base model
.SUBCKT a06Q1 Q1C Q1B Q1E
RB1 Q1B 11 .095 (TC1=0.8E-3)
RB2 11 12 3.26 (TC1=1.2E-3)
RB3 12 B1 2.83 (TC1=1.8E-3)
RE E1 Q1E 0.22 (TC1=0.6E-3)
RC C1 Q1C 10 (TC1=0.6E-3)
Q1 C1 B1 E1 QMSA 438
DCD1 Q1B C1 DMOD 782
DCD2 11 C1 DMOD 609
DCD3 12 C1 DMOD 386
.ENDS
* Q2 distributed base model
.SUBCKT a06Q2 Q2C Q2B Q2E
RB1 Q2B 21 0.95 (TC1=0.8E-3)
RB2 21 22 3.26 (TC1=1.2E-3)
RB3 22 B2 2.83 (TC1=1.8E-3)
RE E2 Q2E 0.22 (TC1=0.6E-3)
RC C2 Q2C 10 (TC1=0.6E-3)
Q1 C2 B2 E2 QMSA 438
DCD1 Q2B C2 DMOD 782
DCD2 21 C2 DMOD 609
DCD3 22 C2 DMOD 386
.ENDS
* DIODE AND TRANSISTOR MODELS USED IN HP MMICS AND DISCRETES
.MODEL DMOD D(IS=1E-25, CJO=2.45E-16, VJ=.76,
+ M=.53, BV=45, IBV=1E-9)
.MODEL QMSA NPN (BF=90, BR=5, IS=1.65E-18, VA=20,
+ TF=12PS, CJE=1.8E-15, VJE=1.01, MJE=0.6,
+ PTF=25, XTB=1.818, VTF=6, ITF=3E-4,
+ IKF=1.333E-4, XTF=4, NF=1.03, ISE=5E-15,
+ NE=2.5)
To complete the transistor model, the above die model must be combined
with one of the following package models.
| file name | description | |
| a0600i16.s2p | MSA-0600 s and noise parameters at 16 mA | 
view |
| a0611i16.s2p | MSA-0611 s and noise parameters at 16 mA |
view |
| a0635i16.s2p | MSA-0635 s and noise parameters at 16 mA |
view |
| a0635i16.s2p | MSA-0636 s and noise parameters at 16 mA |
view |
| a0670i16.s2p | MSA-0670 s and noise parameters at 16 mA |
view |
| a0685i16.s2p | MSA-0685 s and noise parameters at 16 mA |
view |
| a0686i16.s2p | MSA-0686 s and noise parameters at 16 mA |
view |
Applications Literature
General Information about Amplifier ICs
Information about MSA Series IC Amplifiers
Assembly Information
|
