bias: 6 V, 22 mA
f3dB = 2.5 GHz
G = 13.5 dB, NF = 4.5 dB, P1dB = 5.5 dBm, IP3i = +2 dBm
| part number |
NF, dB
@ 1 GHz |
Gp, dB
@ 1 GHz |
package |
outline |
data sheet |
|
 |
| MSA-0711 |
5.0 typ |
12.0 typ
10.0 min |
SOT-143 |
 |
pdf |
|
|
| MSA-0735 |
4.5 typ |
13.5 typ
12.5. min
at 0.1 GHz |
micro-x |
 |
pdf |
|
|
| MSA-0736 |
4.5 typ |
13.5 typ
12.5. min
at 0.1 GHz |
micro-x
trim lead |
 |
pdf |
|
|
| MSA-0770 |
4.5 typ |
13.5 typ
12.5. min
at 0.1 GHz |
70 mil
ceramic |
 |
pdf |
|
|
| MSA-0785 |
5.0 typ |
12.5 typ
10.0 min |
85 mil
plastic |
 |
pdf |
|
|
| MSA-0786 |
5.0 typ |
12.5 typ
10.0 min |
SMT
85 mil
plastic |
 |
pdf |
|
|
MSA-0700
(obsolete) |
4.5 typ |
13.5 typ
@ 0.1 GHz |
chip |
 |
pdf |
|
packages: 00 11 35 36 70 85 86
SPICE model
* MSA-07 MODEL
* Combine with package model to complete
* DIE MODEL
Xa07 DIEOUT DIEIN DIEGND MSa07
.ENDS
* chip model
.SUBCKT MSa07 DIEOUT DIEIN DIEGND
RF DIEIN DIEOUT 360 (TC1=-0.8E-3)
RB DIEIN DIEGND 244 (TC1=-0.8E-3)
RBIAS Q1E DIEGND 215 (TC1=-0.8E-3)
RE Q2E DIEGND 6 (TC1=-0.8E-3)
CF DIEIN DIEOUT 0.067PF
CP1 Q1E DIEOUT 0.020PF
CP2 Q2E DIEOUT 0.045PF
CP3 DIEGND DIEOUT 0.104PF
Xa07Q1 DIEOUT DIEIN Q1E a07Q1
Xa07Q2 DIEOUT Q1E Q2E a07Q2
.ENDS
* Q1 distributed base model
.SUBCKT a07Q1 Q1C Q1B Q1E
RB1 Q1B 11 1.5 (TC1=0.8E-3)
RB2 11 12 4.4 (TC1=1.2E-3)
RB3 12 B1 3.8 (TC1=1.8E-3)
RE E1 Q1E 0.33 (TC1=0.6E-3)
RC C1 Q1C 10 (TC1=0.6E-3)
Q1 C1 B1 E1 QMSA 300
DCD1 Q1B C1 DMOD 602
DCD2 11 C1 DMOD 450
DCD3 12 C1 DMOD 261
.ENDS
* Q2 distributed base model
.SUBCKT a07Q2 Q2C Q2B Q2E
RB1 Q2B 21 1.2 (TC1=0.8E-3)
RB2 21 22 3.1 (TC1=1.2E-3)
RB3 22 B2 2.7 (TC1=1.8E-3)
RE E2 Q2E 0.24 (TC1=0.6E-3)
RC C2 Q2C 10 (TC1=0.6E-3)
Q1 C2 B2 E2 QMSA 420
DCD1 Q2B C2 DMOD 782
DCD2 21 C2 DMOD 629
DCD3 22 C2 DMOD 365
.ENDS
* DIODE AND TRANSISTOR MODELS USED IN HP MMICS AND DISCRETES
.MODEL DMOD D(IS=1E-25, CJO=2.45E-16, VJ=.76,
+ M=.53, BV=45, IBV=1E-9)
.MODEL QMSA NPN (BF=90, BR=5, IS=1.65E-18, VA=20,
+ TF=12PS, CJE=1.8E-15, VJE=1.01, MJE=0.6,
+ PTF=25, XTB=1.818, VTF=6, ITF=3E-4,
+ IKF=1.333E-4, XTF=4, NF=1.03, ISE=5E-15,
+ NE=2.5)
To complete the transistor model, the above die model must be combined
with one of the following package models.
| file name | description | |
| a0700i22.s2p | MSA-0700 s and noise parameters at 22 mA | 
view |
| a0711i22.s2p | MSA-0711 s and noise parameters at 22 mA |
view |
| a0735i22.s2p | MSA-0735 s and noise parameters at 22 mA |
view |
| a0735i22.s2p | MSA-0736 s and noise parameters at 22 mA |
view |
| a0770i22.s2p | MSA-0770 s and noise parameters at 22 mA |
view |
| a0785i22.s2p | MSA-0785 s and noise parameters at 22 mA |
view |
| a0786i22.s2p | MSA-0786 s and noise parameters at 22 mA |
view |
Applications Literature
General Information about Amplifier ICs
Information about MSA Series IC Amplifiers
Assembly Information
|
