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MSA-08 Series
minimum feedback MSA for high gain

 
bias: 10 V, 35 mA
applications to 4 GHz
G = 30 dB (0.1 GHz), 10 dB (4 GHz)
NF = 3dB, P1dB = 12.5 dBm, I P3i = -1 (1GHz)

part number Gp, dB
@ 1 GHz
package outline data sheet FAX
MSA-0835 23.0 typ
22.0 min
micro-x pkg dwg pdf
pdf
 
MSA-0836 23.0 typ
22.0 min
micro-x
trim lead
pkg dwg pdf
pdf
 
MSA-0870 23.0 typ   22.0 typ
11.0 typ   10.0 min
@1 GHz        @4 GHz
70 mil
ceramic
pkg dwg pdf
pdf
 
MSA-0885 22.5 typ
21.0 min
85 mil
plastic
pkg dwg pdf
pdf
 
MSA-0886 22.5 typ
20.5 min
SMT
85 mil
plastic
pkg dwg pdf
pdf
button
55525
MSA-0800
(obsolete)
23.5 typ chip pkg dwg pdf
pdf
 

packages: 00 35 36 70 85 86


MSA-08 Model

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SPICE model

* MSA-08 MODEL
* Combine with package model to complete

* DIE MODEL
Xa08 DIEOUT  DIEIN   DIEGND  MSa08
.ENDS

* chip model
.SUBCKT MSa08   DIEOUT  DIEIN   DIEGND
RF      DIEIN   DIEOUT  6000    (TC1=-0.8E-3)
RB      DIEIN   DIEGND  1600    (TC1=-0.8E-3)
RBIAS   Q1E     DIEGND  85      (TC1=-0.8E-3)
RE      Q2E     DIEGND  0
CP1     Q1E     DIEOUT  0.086PF
CP2     Q2E     DIEOUT  0.021PF
CP3     DIEGND  DIEOUT  0.134PF
Xa08Q1  DIEOUT  DIEIN   Q1E     a08Q1
Xa08Q2  DIEOUT  Q1E     Q2E     a08Q2
.ENDS

* Q1 distributed base model
.SUBCKT a08Q1   Q1C     Q1B     Q1E
RB1     Q1B     11    2.6      (TC1=0.8E-3)
RB2     11      12     9.1     (TC1=1.2E-3)
RB3     12      B1     7.9     (TC1=1.8E-3)
RE      E1      Q1E    0.63    (TC1=0.6E-3)
RC      C1      Q1C    5       (TC1=0.6E-3)
Q1      C1      B1     E1      QMSA    156
DCD1    Q1B     C1     DMOD    377
DCD2    11      C1     DMOD    138
DCD3    12      C1     DMOD    156
.ENDS

* Q2 distributed base model
.SUBCKT a08Q2   Q2C     Q2B     Q2E
RB1     Q2B     21     1.0     (TC1=0.8E-3)
RB2     21      22     3.3     (TC1=1.2E-3)
RB3     22      B2     2.8     (TC1=1.8E-3)
RE      E2      Q2E    0.22    (TC1=0.6E-3)
RC      C2      Q2C    5       (TC1=0.6E-3)
Q1      C2      B2     E2      QMSA    438
DCD1    Q2B     C2     DMOD    782
DCD2    21      C2     DMOD    609
DCD3    22      C2     DMOD    385
.ENDS

.MODEL  DMOD    D(IS=1E-25, CJO=2.45E-16, VJ=.76,
+               M=.53, BV=45, IBV=1E-9)
.MODEL  QMSA    NPN (BF=90, BR=5, IS=1.65E-18, VA=20,
+               TF=12PS, CJE=1.8E-15, VJE=1.01, MJE=0.6,
+               PTF=25, XTB=1.818, VTF=6, ITF=3E-4,
+               IKF=1.333E-4, XTF=4, NF=1.03, ISE=5E-15,
+               NE=2.5)
To complete the transistor model, the above die model must be combined
with one of the following package models.

MSA-0800
chip
package 00 model
MSA-0835
pkg dwg
package 35 model
MSA-0836
pkg dwg
package 36 model
MSA-0870
pkg dwg
package 70 model
MSA-0885
pkg dwg
package 85 model
MSA-0886
pkg dwg
package 86 model


MSA-08 series S Parameter Data

[ top ]
file name description
a0800i36.s2pMSA-0800 s and noise parameters at 36 mAbutton
view
a0835i36.s2pMSA-0835 s and noise parameters at 36 mAbutton
view
a0835i36.s2pMSA-0836 s and noise parameters at 36 mAbutton
view
a0870i36.s2pMSA-0870 s and noise parameters at 36 mAbutton
view
a0885i36.s2pMSA-0885 s and noise parameters at 36 mAbutton
view
a0886i36.s2pMSA-0886 s and noise parameters at 36 mAbutton
view

Applications Literature

General Information about Amplifier ICs
Information about MSA Series IC Amplifiers
Assembly Information

 

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