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MSA-09 Series
wideband MSA for use to 4 GHz

 
bias: 10 V, 35 mA
f3dB= 6 GHz
G = 8 dB, NF = 6 dB, P1dB = 11.5 dBm, IP3i = +13.5 dBm

part number Gp, dB
@ 1 GHz
delta Gp, dB
0.1-4 GHz
package outline data sheet
MSA-0910 8.0 typ
7.0 min
±0.2 typ
±0.5 max
100 mil
ceramic
pkg dwg pdf
pdf
 
MSA-0986 7.2 typ
6.0 min
@ 2 GHz
±0.5 typ
0.1-3 GHz
SMT
85 mil
plastic
pkg dwg
pdf
pdf
 
MSA-0900
(obsolete)
8.0 typ ±0.2 typ chip pkg dwg pdf
pdf
 

packages: 00 10 86


MSA-09 Model

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SPICE model

* MSA-09 MODEL
* Combine with package model to complete

* DIE MODEL
Xa09 DIEOUT  DIEIN   DIEGND MSa09
.ENDS

* chip model
.SUBCKT MSa09   DIEOUT  DIEIN   DIEGND
RF      DIEIN   13      150     (TC1=-0.8E-3) 
RE      Q2E     DIEGND  Q2E     (TC1=-0.8E-3)
RB      DIEIN   DIEGND  2000    (TC1=-0.8E-3)
RBIAS   Q1E     DIEGND  115     (TC1=-0.8E-3)
RDC     DIEIN   DIEOUT  6000    (TC1=-0.8E-3)
CF      DIEIN   DIEOUT  0.114PF
CFB     13      DIEOUT  0.058PF
CP1     Q1E     DIEOUT  0.020PF
CP2     Q2E     DIEOUT  0.023PF
CP3     DIEGND  DIEOUT  0.168PF
CFBL    14      DIEOUT  45PF    ; off-chip component
LF      13      14      0.35NH  ; off-chip component
Xa09Q1  DIEOUT  DIEIN   Q1E     a09Q1
Xa09Q2  DIEOUT  Q1E     Q2E     a09Q2
.ENDS

* Q1 distributed base model
.SUBCKT a09Q1   Q1C     Q1B     Q1E
RB1     Q1B     11     2.6     (TC1=0.8E-3)
RB2     11      12     9.1     (TC1=1.2E-3)
RB3     12      B1     7.9     (TC1=1.8E-3)
RE      E1      Q1E    0.63    (TC1=0.6E-3)
RC      C1      Q1C    5       (TC1=0.6E-3)
Q1      C1      B1     E1      QMSA    156
DCD1    Q1B     C1     DMOD    377
DCD2    11      C1     DMOD    138
DCD3    12      C1     DMOD    156
.ENDS

* Q2 distributed base model
.SUBCKT a09Q2   Q2C     Q2B     Q2E
RB1     Q2B     21     1.0     (TC1=0.8E-3)
RB2     21      22     3.3     (TC1=1.2E-3)
RB3     22      B2     2.8     (TC1=1.8E-3)
RE      E2      Q2E    0.22    (TC1=0.6E-3)
RC      C2      Q2C    5       (TC1=0.6E-3)
Q1      C2      B2     E2      QMSA    438
DCD1    Q2B     C2     DMOD    782
DCD2    21      C2     DMOD    609
DCD3    22      C2     DMOD    385
.ENDS

.MODEL  DMOD    D(IS=1E-25, CJO=2.45E-16, VJ=.76,
+               M=.53, BV=45, IBV=1E-9)
.MODEL  QMSA    NPN (BF=90, BR=5, IS=1.65E-18, VA=20,
+               TF=12PS, CJE=1.8E-15, VJE=1.01, MJE=0.6,
+               PTF=25, XTB=1.818, VTF=6, ITF=3E-4,
+               IKF=1.333E-4, XTF=4, NF=1.03, ISE=5E-15,
+               NE=2.5)
To complete the transistor model, the above die model must be combined
with one of the following package models.

MSA-0900
chip
package 00 model
MSA-0910
pkg dwg
package 10 model
MSA-0986
pkg dwg
package 86 model


MSA-09 series S Parameter Data

[ top ]
file name description
a0900i35.s2pMSA-0900 s parameters at 35 mAbutton
view
a0910i35.s2pMSA-0910 s and noise parameters at 35 mAbutton
view
a0986i35.s2pMSA-0986 s and noise parameters at 35 mAbutton
view

Applications Literature

General Information about Amplifier ICs
Information about MSA Series IC Amplifiers
Assembly Information

 

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