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MSA-11 Series
high dynamic range MSA

 
bias: 8V, 60 mA
f3dB = 1.6 GHz
G = 12.5 dB, NF = 3.5, P1dB = 17.5, IP3i = +5dBm

part number Gp, dB
@ 0.1 GHz
P1dB, dBm
@ 0.5 GHz
package outline data sheet
MSA-1104 12.0 typ
10.0 min
@ 0.5 GHz
17.5 typ 145 mil
plastic
pkg dwg pdf
pdf
 
MSA-1105 12.0 typ
10.0 min
@ 0.5 GHz
17.5 typ SMT
145 mil
plastic
pkg dwg pdf
pdf
 
MSA-1110 12.5 typ
11.5 min
17.5 typ
16.0 min
100 mil
ceramic
pkg dwg pdf
pdf
 
MSA-1120 12.5 typ
11.5 min
17.5 typ
16.0 min
200 mil
BeO disc
pkg dwg pdf
pdf
 
MSA-1100
(obsolete)
12.5 typ 17.5 typ chip pkg dwg pdf
pdf
 

packages: 04 05 10 20


MSA-11 Model

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SPICE model

* MSA-11 MODEL
* Combine with package model to complete

* DIE MODEL
XA11 DIEOUT  DIEIN   DIEGND MSA11
.ENDS

* chip model
.SUBCKT MSA11   DIEOUT  DIEIN   DIEGND
RF      DIEIN   13      300     (TC1=-0.8E-3)
RE      Q2E     DIEGND  10      (TC1=-0.8E-3)
RB      DIEIN   DIEGND  2400    (TC1=-0.8E-3)
RBIAS   Q1E     DIEGND  80      (TC1=-0.8E-3)
RDC     DIEIN   DIEOUT  4000    (TC1=-0.8E-3)
CF      DIEIN   DIEOUT  0.10PF
CFB     13      DIEOUT  0.058PF
CP1     Q1E     DIEOUT  0.050PF
CP2     Q2E     DIEOUT  0.080PF
CP3     DIEGND  DIEOUT  0.1208PF
CFBL    14      DIEOUT  200PF
LF      13      14      0.35NH
XA11Q1  DIEOUT  DIEIN   Q1E     A11Q1
XA11Q2  DIEOUT  Q1E     Q2E     A11Q2
.ENDS

* Q1 distributed base model
.SUBCKT A11Q1   Q1C     Q1B     Q1E
RB1     Q1B     11     0.42    (TC1=0.8E-3)
RB2     11      12     1.42    (TC1=1.2E-3)
RB3     12      B1     1.24    (TC1=1.8E-3)
RE      E1      Q1E    0.10    (TC1=0.6E-3)
RC      C1      Q1C    5       (TC1=0.6E-3)
Q1      C1      B1     E1      QMSA    1000
DCD1    Q1B     C1     DMOD    1591
DCD2    11      C1     DMOD    1392
DCD3    12      C1     DMOD    882
.ENDS

* Q2 distributed base model
.SUBCKT A11Q2   Q2C     Q2B     Q2E
RB1     Q2B     21     0.67    (TC1=0.8E-3)
RB2     21      22     2.3     (TC1=1.2E-3)
RB3     22      B2     2.0     (TC1=1.8E-3)
RE      E2      Q2E    0.16    (TC1=0.6E-3)
RC      C2      Q2C    5       (TC1=0.6E-3)
Q1      C2      B2     E2      QMSA    625
DCD1    Q2B     C2     DMOD    1051
DCD2    21      C2     DMOD    870
DCD3    22      C2     DMOD    551
.ENDS


.MODEL  DMOD    D(IS=1E-25, CJO=2.45E-16, VJ=.76,
+               M=.53, BV=45, IBV=1E-9)
.MODEL  QMSA    NPN (BF=90, BR=5, IS=1.65E-18, VA=20,
+               TF=12PS, CJE=1.8E-15, VJE=1.01, MJE=0.6,
+               PTF=25, XTB=1.818, VTF=6, ITF=3E-4,
+               IKF=1.333E-4, XTF=4, NF=1.03, ISE=5E-15,
+               NE=2.5)
To complete the transistor model, the above die model must be combined
with one of the following package models.

MSA-1100
chip
package 00 model
MSA-1104
pkg dwg
package 04 model
MSA-1105
pkg dwg
package 05 model
MSA-1110
pkg dwg
package 10 model
MSA-1120
pkg dwg
package 20 model


MSA-11 series S Parameter Data

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file name description
a1100i60.s2pMSA-1100 s and noise parameters at 60 mAbutton
view
a1104i60.s2pMSA-1104 s and noise parameters at 60 mAbutton
view
a1105i60.s2pMSA-1105 s and noise parameters at 60 mAbutton
view
a1110i60.s2pMSA-1110 s and noise parameters at 60 mAbutton
view
a1120i60.s2pMSA-1120 s and noise parameters at 60 mAbutton
view

Applications Literature

General Information about Amplifier ICs
Information about MSA Series IC Amplifiers
Assembly Information

 

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