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What's New   RFGlobalnet   www /go/rf   Search /go/rf   Transistor Specification Selection Guide   BJT Package Options                                         SMT   SMT SMT   package: 08 11 25 32 33 43 63 86 85 35 36 10 70 20 23 00 family plastic cer hermetic power chip AT-305xx       AT-310xx       AT-316xx     AT-320xx         AT-332xx     AT-364xx   AT-380xx       AT-414xx       AT-415xx         AT-420xx     AT-640xx     HBFP-0405     HBFP-0420     What: available bipolar transistor packages Direction: depends on application Surface mount (SMT) compatibility is a requirement for most volume assembly applications. Plastic packages limit maximum junction temperatures to 150 C vs 200 C for other packages, so may limit performance of power products. Ceramic or hermetic packages are typically required for hi-rel applications, and typically offer better performance through reduced parasitics. Packages with high parasitic inductance and/or capacitance (typically plastic packages) may severely limit device performance at higher frequencies (above 2 GHz). Range: SMT (surface mount) Surface mount packages have co-planer leads that allow for device mounting without the use of through holes. Surface mount capability is generally considered to be a requirement for automated assembly. plastic 08 SO-8: 8 lead industry standard (for power) 11 SOT-143: industry standard low parasitic 25 MSOP-3: mini-mold for power applications 32 SOT-323: SC-70 3 lead miniature 33 SOT-23: 3 lead industry standard 43 SOT-343: SC-70 4 lead miniature 63 SOT-363: SC-70 6 lead miniature 86 4 formed lead 85 mil low parasitic improved thermals ceramic 35 4 lead ceramic "micro-x" 36 4 lead ceramic "micro-x" with lead trim hermetic 10 4 lead 100 mil stripline for high performance for larger die 70 4 lead 70 mil stripline for high performance non-SMT chip 00 unpackaged chip plastic 85 4 axial lead 85 mil low parasitic improved thermals power 20 200 mil BeO disc 23 230 mil BeO flange

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