UltraCMOS™ Technology Process Options

0.5 µm UltraCMOS 'FA Process' (Standard Flow)
This is the core process for the 'F' series 0.5 µm UltraCMOS processes. A wide variety of digital, analogue and optoelectronic products have been realized in this process. The basic feature set consists of:

  • Three NMOS and three PMOS threshold voltages available
  • Single polysilicon - silicided
  • Three metal layers

0.5 µm UltraCMOS 'FC Process' (Thick Metal + Capacitors)
In this process variant, the final metal layer is thickened to improve inductor performance over the standard metal layer available in the FA process. The process also defines high quality metal to metal capacitors between the two topmost metal layers, enabling very high performance RF tuned circuits to be fully integrated on-chip.

  • Three NMOS and three PMOS threshold voltages available
  • Single polysilicon - silicided
  • Three metal layers
  • Improved inductor performance
  • Metal to metal capacitors

0.5 µm UltraCMOS 'FD Process' (Simplified Flow)
A simplified version of the FA Process intended specifically for low transistor count RF applications not requiring triple metal. Also available in a further simplification with only four threshold voltage variants.

  • Total of six or four threshold voltages available (3/2 NMOS and 3/2 PMOS)
  • Single Polysilicon - silicided
  • Two metal layers

0.5 µm UltraCMOS 'FN Process' (Radiation Hard FA Variant)
UltraCMOS processes are, compared to bulk CMOS, intrinsically radiation tolerant, since many of the conduction paths that degrade bulk radiation response are not present. To further optimise radiation performance over the standard FA process this FN process variant modifies certain threshold implants. All other process features remain:

  • Three NMOS and three PMOS threshold voltages available
  • Single polysilicon - silicided
  • Three metal layers

0.25 µm UltraCMOS 'GA Process'
This 0.25 µm gate process is intended to extend the already highly capable FA process RF performance into the deep GHz regime while maintaining manufacturability on the PSA tool set. Process features are similar to those of the 0.5 µm UltraCMOS series:

  • Three NMOS and three PMOS threshold voltages available
  • Silicided diffusions & polysilicon
  • Three metal layers

By selecting Peregrine’s UltraCMOS™ technology, you can count on our expertise and outstanding support throughout the entire foundry process.



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