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Information on package SOD118A; Hermetically sealed plastic package; axial leaded; 2 leads
Outline drawing of package SOD118A | |
Package version | Packagename | Package description | Issue date |
SOD118A | - | Hermetically sealed plastic package; axial leaded; 2 leads | 98-05-28 |
Chemical content of package SOD118 | |
Part |
Material |
Weight (mg) |
|
Leadframe |
Fe. Cu cladded70/30
|
113.60 mg |
Stud |
Mo
|
4.80 mg |
Solder/brazing pellet |
AgCu28GeCo |
0.43 mg |
Plastic/encapsulation |
Epoxy moulding compound
|
56 mg |
Active device |
Si
|
1.90 mg |
Plating |
SnPb20 |
1.30 mg |
|
Total amount (approx.): |
178.29 mg |
Composition of AgCu28GeCo
Ag | 69.7
% | Co | 0.3
% | Cu | 28
% | Ge | 2
% |
Composition of SnPb20
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