|
|
|
Information on package SOD323; Plastic surface mounted package; 2 leads
| Outline drawing of package SOD323 |  |
| Package version | Packagename | Package description | Issue date |
| SOD323 | SC-76; UMD2; I-IEIA; URP | Plastic surface mounted package; 2 leads | 99-09-13 |
| Chemical content of package SOD323 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
Cu
|
1 mg |
| Bond wire |
Au
|
mg |
| Plastic/encapsulation |
Epoxy
|
4 mg |
| Active device |
Si
|
0.07 mg |
| Plating |
SnPb20 |
0.20 mg |
|
| Total amount (approx.): |
4.8 mg |
Composition of SnPb20
|
