Go to the CD home page
   
Discretes
Sales Offices & Distributors
 
Catalog tree
-Automotive
-Communications
-Consumer Multimedia
-Discrete semiconductors
-General-purpose / Linear
-Logic
-Microcontrollers
-Programmable logic
Cross reference
Models
Packages
Application notes
Selection guides
Other technical documentation
End of Life information
Information on package SOD61AC; Hermetically sealed glass package; axial leaded; 2 leads

Outline drawing of package SOD61ACGo to the top of this page
Package versionPackagenamePackage descriptionIssue date
SOD61AC Hermetically sealed glass package; axial leaded; 2 leads 97-06-20 

Chemical content of package SOD61Go to the top of this page
Part Material Weight (mg)
Leadframe Fe. Cu cladded70/30 135 mg
Stud Mo 25 mg
Solder/brazing pellet AgCu28GeCo 1.53 mg
Plastic/encapsulation Zinc borosilicate glass 84 mg
Active device Si 3 mg
Plating SnPb20 1.55 mg
Total amount (approx.): 250.335 mg
Composition of AgCu28GeCo
Ag69.7 %
Co0.3 %
Cu28 %
Ge2 %

Composition of SnPb20
Pb20 %
Sn80 %

Copyright © 2000
Royal Philips Electronics
All rights reserved.
Terms and conditions.


Go to Philips Semiconductors' home page Philips home Feedback your comments and questions Go to semiconductors.com search / index