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Information on package SOD64; Hermetically sealed glass package; axial leaded; 2 leads
| Outline drawing of package SOD64 |  |
| Package version | Packagename | Package description | Issue date |
| SOD64 | - | Hermetically sealed glass package; axial leaded; 2 leads | 97-10-14 |
| Chemical content of package SOD64 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
Fe. Cu cladded70/30
|
684 mg |
| Stud |
Mo
|
91 mg |
| Solder/brazing pellet |
AgCu28GeCo |
3.27 mg |
| Plastic/encapsulation |
Lead borosilicate glass
|
50 mg |
| Active device |
Si
|
1.60 mg |
| Plating |
SnPb20 |
2.93 mg |
|
| Total amount (approx.): |
832.6 mg |
Composition of AgCu28GeCo
| Ag | 69.7
% | | Co | 0.3
% | | Cu | 28
% | | Ge | 2
% |
Composition of SnPb20
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