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Information on package SOD87; Hermetically sealed glass surface mounted package; ImplotecTM technology; 2 connectors; Implotec is a trademark of Philips
| Outline drawing of package SOD87 |  |
| Package version | Packagename | Package description | Issue date |
| SOD87 | 100H03; LLDL | Hermetically sealed glass surface mounted package; ImplotecTM technology; 2 connectors; Implotec is a trademark of Philips | 99-06-04 |
| Chemical content of package SOD87 | |
| Part |
Material |
Weight (mg) |
|
| Stud |
Mo
|
10.10 mg |
| Solder/brazing pellet |
AgCu26Ni7 |
0.80 mg |
| Flange |
Cu
|
17 mg |
| Plastic/encapsulation |
Lead borosilicate glass
|
20 mg |
| Active device |
Si
|
0.58 mg |
| Plating |
SnPb20 |
0.88 mg |
|
| Total amount (approx.): |
49.97 mg |
Composition of AgCu26Ni7
Composition of SnPb20
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