|
|
|
Information on package SOD91; Hermetically sealed glass package; ImplotecTM technology; axial leaded; 2 leads; Implotec is a trademark of Philips
| Outline drawing of package SOD91 |  |
| Package version | Packagename | Package description | Issue date |
| SOD91 | - | Hermetically sealed glass package; ImplotecTM technology; axial leaded; 2 leads; Implotec is a trademark of Philips | 97-06-09 |
| Chemical content of package SOD91 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
Fe. Cu cladded70/30
|
102.80 mg |
| Stud |
Mo
|
7.41 mg |
| Solder/brazing pellet |
AgCu26Ni7 |
0.75 mg |
| Plastic/encapsulation |
Lead borosilicate glass
|
10 mg |
| Active device |
Si
|
0.26 mg |
| Plating |
SnPb20 |
0.18 mg |
|
| Total amount (approx.): |
121.41 mg |
Composition of AgCu26Ni7
Composition of SnPb20
|
