Discretes Sales Offices & Distributors   Catalog tree Automotive Communications Consumer Multimedia Discrete semiconductors General-purpose / Linear Logic Microcontrollers Programmable logic Cross reference Models Packages Application notes Selection guides Other technical documentation End of Life information

Information on package SOT313-2; plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm Outline drawing Chemical content Outline drawing of package SOT313-2 Package version Packagename Package description Issue date SOT313-2  LQFP48  plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm  97-08-01  Chemical content of package SOT313 Part Material Weight (mg) Leadframe CuCr 65 mg Bwire/die attach G 1.64 mg Plastic/encapsulation KMC184-8 105 mg Active device Si 20 mg Plating SnPb20 15 mg Total amount (approx.): 206.64 mg Composition of CuCr Cr 0.3 % Cu 99.4 % Composition of KMC184-8 Br 1.1 % Sb 3 % SiO2 80 % epoxy 15.9 % Composition of SnPb20 Pb 20 % Sn 80 %

Copyright © 2000 Royal Philips Electronics All rights reserved. Terms and conditions.