Go to the CD home page
   
Discretes
Sales Offices & Distributors
 
Catalog tree
-Automotive
-Communications
-Consumer Multimedia
-Discrete semiconductors
-General-purpose / Linear
-Logic
-Microcontrollers
-Programmable logic
Cross reference
Models
Packages
Application notes
Selection guides
Other technical documentation
End of Life information
Information on package SOT316-1; plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm

Outline drawing of package SOT316-1Go to the top of this page
Package versionPackagenamePackage descriptionIssue date
SOT316-1 SQFP208 plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm 99-09-08 

Chemical content of package SOT316Go to the top of this page
Part Material Weight (mg)
Leadframe CuNi3 670 mg
Bwire/die attach G 0 mg
Plastic/encapsulation EME-6300H 4350 mg
Active device Si 20 mg
Plating SnPb20 33 mg
Total amount (approx.): 5073 mg
Composition of CuNi3
Cu96.2 %
Ni3 %

Composition of SnPb20
Pb20 %
Sn80 %

Copyright © 2000
Royal Philips Electronics
All rights reserved.
Terms and conditions.


Go to Philips Semiconductors' home page Philips home Feedback your comments and questions Go to semiconductors.com search / index