Discretes Sales Offices & Distributors   Catalog tree Automotive Communications Consumer Multimedia Discrete semiconductors General-purpose / Linear Logic Microcontrollers Programmable logic Cross reference Models Packages Application notes Selection guides Other technical documentation End of Life information

Information on package SOT319-2; plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm Outline drawing Chemical content Outline drawing of package SOT319-2 Package version Packagename Package description Issue date SOT319-2  QFP64  plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm  97-08-01  Chemical content of package SOT319 Part Material Weight (mg) Leadframe CuNi3 336 mg Bwire/die attach G 2.53 mg Plastic/encapsulation EME-6300H 1292 mg Active device Si 20 mg Plating SnPb20 27 mg Total amount (approx.): 1677.53 mg Composition of CuNi3 Cu 96.2 % Ni 3 % Composition of SnPb20 Pb 20 % Sn 80 %

Copyright © 2000 Royal Philips Electronics All rights reserved. Terms and conditions.