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Information on package SOT340-1; plastic shrink small outline package; 24 leads; body width 5.3 mm
Outline drawing of package SOT340-1 |  |
Package version | Packagename | Package description | Issue date |
SOT340-1 | SSOP24 | plastic shrink small outline package; 24 leads; body width 5.3 mm | 95-02-04 |
Chemical content of package SOT340 |  |
Part |
Material |
Weight (mg) |
|
Leadframe |
CuFe2P |
40 mg |
Bwire/die attach |
G |
0 mg |
Plastic/encapsulation |
KMC184-8 |
117 mg |
Active device |
Si
|
0 mg |
Plating |
SnPb20 |
5 mg |
|
Total amount (approx.): |
162 mg |
Composition of CuFe2P
Composition of KMC184-8
Br | 1.1
% | Sb | 3
% | SiO2 | 80
% | epoxy | 15.9
% |
Composition of SnPb20
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