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Information on package SOT399; Plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole; 3 in-line leads
| Outline drawing of package SOT399 |  |
| Package version | Packagename | Package description | Issue date |
| SOT399 | TOP-3D | Plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole; 3 in-line leads | 98-11-06 |
| Chemical content of package SOT399 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
Cu
|
3800 mg |
| Solder/brazing pellet |
SnAg25Sb10
|
8 mg |
| Bond wire |
Al
|
12 mg |
| Plastic/encapsulation |
Epoxy
|
2904 mg |
| Active device |
Si
|
20 mg |
| Plating |
SnPb20 |
102 mg |
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| Total amount (approx.): |
6846 mg |
Composition of SnPb20
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