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Information on package SOT482B; Leadless surface mounted package; plastic cap; 4 terminations

Outline drawing of package SOT482BGo to the top of this page
Package versionPackagenamePackage descriptionIssue date
SOT482B Leadless surface mounted package; plastic cap; 4 terminations 99-08-16 

Chemical content of package SOT48Go to the top of this page
Part Material Weight (mg)
Leadframe FeNi42 670 mg
Heatspreader BeO 365 mg
Solder/brazing pellet AgCu28GeCo 50 mg
Nut CuZn37 2225 mg
Plastic/encapsulation Epoxy 670 mg
Active device Si 20 mg
Total amount (approx.): 4000 mg
Composition of FeNi42
Co0.5 %
Fe56.5 %
Mn1 %
Ni42 %

Composition of AgCu28GeCo
Ag69.7 %
Co0.3 %
Cu28 %
Ge2 %

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