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Information on package SOT482C; Leadless surface mounted package; plastic cap; 4 terminations
| Outline drawing of package SOT482C |  |
| Package version | Packagename | Package description | Issue date |
| SOT482C | - | Leadless surface mounted package; plastic cap; 4 terminations | 99-08-16 |
| Chemical content of package SOT48 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
FeNi42 |
670 mg |
| Heatspreader |
BeO
|
365 mg |
| Solder/brazing pellet |
AgCu28GeCo |
50 mg |
| Nut |
CuZn37
|
2225 mg |
| Plastic/encapsulation |
Epoxy
|
670 mg |
| Active device |
Si
|
20 mg |
|
| Total amount (approx.): |
4000 mg |
Composition of FeNi42
| Co | 0.5
% | | Fe | 56.5
% | | Mn | 1
% | | Ni | 42
% |
Composition of AgCu28GeCo
| Ag | 69.7
% | | Co | 0.3
% | | Cu | 28
% | | Ge | 2
% |
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