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Information on package SOT97-1; plastic dual in-line package; 8 leads (300 mil)
| Outline drawing of package SOT97-1 |  |
| Package version | Packagename | Package description | Issue date |
| SOT97-1 | DIP8 | plastic dual in-line package; 8 leads (300 mil) | 95-02-04 |
| Chemical content of package SOT97 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
CuFe2P |
153 mg |
| Bwire/die attach |
G |
0.18 mg |
| Plastic/encapsulation |
SUMITOMO EME6210 |
307 mg |
| Active device |
Si
|
20 mg |
| Plating |
SnPb20 |
3 mg |
|
| Total amount (approx.): |
483.18 mg |
Composition of CuFe2P
Composition of SUMITOMO EME6210
| Br | 0.6
% | | Sb | 3.9
% | | SiO2 | 71
% | | epoxy | 24.5
% |
Composition of SnPb20
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