Philips Semiconductors means innovation, and not only in better-performing products. We look at innovation from all sides, covering technologies, packaging and production.

Like our double-polysilicon technology which provides exceptional 2 GHz performance at less cost than competing technologies for your RF products, and our new TrenchMOS transistors, offering the highest possible current rating per square millimetre for your power discrete applications.

In packaging, our latest innovations are in multi-chip modules and our new V-pack technology - integrated single package solutions which help shrink your designs and raise performance. And in production, our revolutionary BIM lines (Breakthrough-In-Manufacturing) take whole wafers automatically hrough to final, electrically triple-tested packaged parts, that have a reject rate measured in parts-per-billion.