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Information on package SOT223; Plastic surface mounted package; collector pad for good heat transfer; 4 leads
| Outline drawing of package SOT223 |  |
| Package version | Packagename | Package description | Issue date |
| SOT223 | SC-73 | Plastic surface mounted package; collector pad for good heat transfer; 4 leads | 99-09-13 |
| Chemical content of package SOT223 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
Cu
|
60 mg |
| Bond wire |
Au
|
0.50 mg |
| Plastic/encapsulation |
Epoxy
|
58 mg |
| Active device |
Si
|
1.20 mg |
| Plating |
SnPb20 |
3.50 mg |
|
| Total amount (approx.): |
123.2 mg |
Composition of SnPb20
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