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Information on package SOT266-1; plastic shrink small outline package; 20 leads; body width 4.4 mm
| Outline drawing of package SOT266-1 |  |
| Package version | Packagename | Package description | Issue date |
| SOT266-1 | SSOP20 | plastic shrink small outline package; 20 leads; body width 4.4 mm | 95-02-25 |
| Chemical content of package SOT266 | |
| Part |
Material |
Weight (mg) |
|
| Leadframe |
CuNi3 |
37 mg |
| Bwire/die attach |
G |
0.78 mg |
| Plastic/encapsulation |
SUMITOMO EME6210 |
38 mg |
| Active device |
Si
|
0 mg |
| Plating |
SnPb20 |
7 mg |
|
| Total amount (approx.): |
82.78 mg |
Composition of CuNi3
Composition of SUMITOMO EME6210
| Br | 0.6
% | | Sb | 3.9
% | | SiO2 | 71
% | | epoxy | 24.5
% |
Composition of SnPb20
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