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Information on package SOT270-1; plastic shrink dual in-line package; 42 leads (600 mil)

Outline drawing of package SOT270-1Go to the top of this page
Package versionPackagenamePackage descriptionIssue date
SOT270-1 SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) 95-02-04 

Chemical content of package SOT270Go to the top of this page
Part Material Weight (mg)
Leadframe CuFe2P 1034 mg
Bwire/die attach G 2.02 mg
Plastic/encapsulation MP180 3401 mg
Active device Si 20 mg
Plating SnPb20 51 mg
Total amount (approx.): 4508.02 mg
Composition of CuFe2P
Cu97.97 %
Fe2 %
Pb0.03 %

Composition of MP180
Br %
Sb %
SiO273 %
epoxy %

Composition of SnPb20
Pb20 %
Sn80 %

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