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Information on package SOT341; Plastic small outline package; 20 leads; body width 7.5 mm Outline drawing Chemical content Outline drawing of package SOT341 Package version Packagename Package description Issue date SOT341  SSOP28; MO-150AH  Plastic small outline package; 20 leads; body width 7.5 mm  95-02-04  Chemical content of package SOT341 Part Material Weight (mg) Leadframe CuFe2P 59 mg Bwire/die attach G 0 mg Plastic/encapsulation KMC184-8 150 mg Active device Si 0 mg Plating SnPb20 6 mg Total amount (approx.): 215 mg Composition of CuFe2P Cu 97.97 % Fe 2 % Pb 0.03 % Composition of KMC184-8 Br 1.1 % Sb 3 % SiO2 80 % epoxy 15.9 % Composition of SnPb20 Pb 20 % Sn 80 %

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