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Information on package SOT370-1; plastic shrink small outline package; 48 leads; body width 7.5 mm Outline drawing Chemical content Outline drawing of package SOT370-1 Package version Packagename Package description Issue date SOT370-1  SSOP48  plastic shrink small outline package; 48 leads; body width 7.5 mm  95-02-04  Chemical content of package SOT370 Part Material Weight (mg) Leadframe CuNi3 145 mg Bwire/die attach G 2.5 mg Plastic/encapsulation KMC184-8 430 mg Active device Si 0 mg Plating SnPb20 8 mg Total amount (approx.): 585.5 mg Composition of CuNi3 Cu 96.2 % Ni 3 % Composition of KMC184-8 Br 1.1 % Sb 3 % SiO2 80 % epoxy 15.9 % Composition of SnPb20 Pb 20 % Sn 80 %

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